- Ion species: B +, BF2 +, P +, As +, In +, etc.
- Dose: 1011 ~ 1015 ions / cm2
- Acceleration energy: 5Kev ~ 4.6Mev
- RTA processing
Blanket Film Wafers (film-coated wafer)

Various kinds of flim services are available by Advantec.
| Category | Film Type | Process | Category | Film Type | Process |
| Oxide | Th-SiO2 | Thermal | Low-K | BD | CVD |
| Low-Particle Th-SiO2 * | Thermal | BDⅡX | CVD | ||
| PE-SiO2 | PE-CVD | AURORA | CVD | ||
| PE-TEOS | PE-CVD | CORAL | CVD | ||
| LP-CVD TEOS | PE-CVD | Metal | Ta, TaN | Spatter | |
| HDP | PE-CVD | Ti, TiN | Spatter | ||
| USG | PE-CVD | W | SpUtter, CVD | ||
| PSG | CVD | Cr | Spatter | ||
| BPSG | CVD | Cu | Spatter, EP | ||
| RTO | Anneal | Al, Al - Cu, Al - Si | Spatter | ||
| Poly Silicon | Doped / non Doped Poly | LP-CVD | Pt | Spatter | |
| Amorphous | PE-CVD | Ni | Spatter | ||
| Nitride | LP-CVD SIN | LP-CVD | Ru | Spatter | |
| PE-CVD SIN | PE-CVD | Pd | Spatter | ||
| Photo Resists | I-Line | Coating | Au | Spatter | |
| KrF | Coating | Co | Spatter | ||
| ArF | Coating | etc. |
Spatter |
Low Particle Thermal Oxide Wafer (low-defect thermal oxide film wafer)
Low Particle Thermal Oxide Wafer formed in a state-of-the-art oxidizing furnace that controls particles and metal contamination is proposed.

Atomic Layer Deposition (ALD film)

Next Generation Gate Material
Ion Implantation Wafer (ion implantation wafer)
